12x300in Dry Film Photoresist For Pcb, Dupont Riston Photo Resist

US $49.00

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Jan 29th

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This listing is for Dry Film Negative Photoresist from Dupont (Riston Special FX Series -FX515) 12x300in Roll, size (30x750cm). This type of Photoresist was designed by Dupont for Fine Line Print and Etch in photochemical machining and PWB applications with acidic etching. It features mean 15 micron thickness and provides one of the highest resolution among dry line photoresist series produced by Dupont. Recommended for ultrafine line applications like copper-flex laminates acidic and alkaline patterning with line/space resolution down to 25-30 microns. For more information on processing and application please refer to FX-515 Data Sheet: http://www2.dupont.com/Imaging_Materials/en_US/assets/downloads/datasheets/Fx515.pdf FX-515 features high exposure sensitivity, wide process window and use standard aqueous solution developer as well as remover. It is completely environmental friendly, has no odor issues and shows an excellent shelf life. If you need bigger size or volume (18in (45cm) width rolls) of FX-515 as well as supplementary chemistry (developer, remover) please check my other listings or contact me. Multiple of the same items are available. Questions are welcome. Due to the nature of product we don't combined shipping on this item with the other type of items, it is sold as is with no return. Worldwide Economy and Expedited shipping available. Expedited shipping includes insurance and tracking. Payment is due within 3 days. Buyer is responsible for all local taxes and customs fees whenever applicable. P.S. This product was targeted only to US market and available only from US distributors as the wholesale lots. It is priced about 6 times more than normal 50um dry film resist from Dupont. This is your chance to buy it now in a smaller quantities with no geographic restrictions at the very competitive prices! Please check out my other items! and thanks for looking. How to use Riston FX-515: Many dry film products are supplied as a laminate consisting of two to three layers. In the case of common photopolymers (e.g. DuPont Riston FX-515 photoresist), there are three layers; a peel sheet (or release-liner), the resist film, and a ultraviolet (UV) transparent cover sheet. Peel sheet: A polyolefin release liner that covers the thermally active adhesive on the bottom of the photopolymer. This layer is typically automatically removed (stripped) by the laminator immediately prior to lamination (it can be manually removed with a piece of scotch tape attached to the corner of photoresist laminate). Resist film: A UV curable, aqueous-developable, super-viscous-liquid film. Cover sheet: The outer covering of the multilayered film is usually made of heat resistant polyester (PET, a.k.a. Mylar). Since it functions as an oxygen block (see below) as well as a protective layer, it should remain in place on the outer layer of the resist until the board is ready to be developed. The cover sheet should be left in place at least 15 minutes after exposure and should only be removed immediately prior to developing. Operating notes: Always wear gloves when cleaning and handling copper clad prior to dry-film lamination Dry-film lamination must be performed under incandescent or UV-proofed fluorescent lights. Store laminated boards in a light-tight enclosure if they will not be processed immediately. How to use Riston FX-515: For specs and detailed information on Dupont Riston FX-515 please refer to manufacturers information: http://www2.dupont.com/Imaging_Materials/en_US/assets/downloads/datasheets/Fx515.pdf ? 1. Preparation: Clean your PCB using one or more standard techniques. Cut dry film slightly bigger size than your board dimensions. ? 2. Apply Resist: This Photoresist has 3 layers, the top and bottom layers are clear protective layer, so at the first, you need remove one protective layer, the easy way is to use two small pieces of scotch tape attached to opposite sites. Polyolefin protective layer peels off first. Then apply the middle layer on top of your PCB using either hot (pouch) laminator or manually. a) Apply using a hot roll laminator. This is the easiest and professional way to do it. b) Apply manually. Starting from one corner and ending to the cross corner, use your fingers, rubber roll or palm to remove all air bubble between film and board. Some techniques suggest using wet lamination. Wet lamination works better but requires more attention to water layer thickness and settlement time after application. Set the iron temperature about 130°C (105-110°C for wet lamination). Apply the hot iron down onto the film and PCB, pressing them to make a good flat contact. It’s good idea to have a Teflon or Viton rubber sheet between iron and your PCB. It makes more uniform pressure distribution. After hot lamination please allow PCB to cool down slowly and give some time to settle. ? 3. Photoresist Imaging: Place your negative artwork over the rest protective layer. Use the plane glass to press your artwork to the PCB, then expose to UV light source (sunlight works as well). It’s recommended the source of light to be at least 12" away from the artwork. Before actual exposure you need to calibrate your light source in order to find the correct exposure time window which is dependent upon intensity and radiation spectrum as well as photoresist sensitivity. Dupont Riston Series has embedded feature to change its color from light blue to dark blue when exposure reached their dose. Both underexposure and overexposure have impact upon photoresist resolution. After exposure carefully remove the artwork (DO NOT REMOVE THE MYLAR COVER SHEETS!) and let the board sit for at least 5 minute in a cool, UV safe area. Dry-film photopolymers used in the printed circuit industry (e.g. photoresist) are exposed using ultraviolet (UV) radiation in the range of 300 nm (nanometers) to 440 nm. For the home shop, a much smaller system is usually adequate. Since throughput is a secondary concern, the radiant output can be much lower and still provide acceptable performance. Two things that cannot be traded off, however, are source collimation and uniformity of illumination. Source collimation, or the degree of parallelism with which the UV light illuminates the artwork/sensitized substrate, ultimately determines the fidelity of image transfer and the minimum size feature that can be reliably resolved. With most practical light sources, there is always going to be a tradeoff between collimation and the total radiant flux reaching the photoresist. At one extreme, you could place your source at infinity (or pretty far away if infinity is out of the question) and achieve a very high degree of collimation. The inverse square law, of course, would reduce the total amount to light actually striking your laminated copper clad to next to nothing, so exposure times on the order of millennia might be expected. At the other extreme, you could put the source right up against the board being exposed to achieve very short exposure times, but, the divergence of the incident light would be so extreme that resolving fine details would be impossible. Uniformity of illumination determines the consistency of exposure from one point to another and affects the trace-width uniformity in the developed image. From a uniformity point of view, the ideal source would be an isotropic emitter whose emission area was as large as, or larger than the substrate you are imaging. Any light source intended for use in PCB production must strike an acceptable balance between these two factors and the cost of implementation. ? 4. Develop: Remember: you need NEGATIVE film developer (please refer to Riston application notes). Carefully peel off the Mylar cover sheet(s) and develop the board in the developer solution that is mixed by 1g developer powder with 90-100ml of water (~1.1% by weight). It’s recommended to heat up developer solution to 30-40°C in order to speed up development time. Remember that overdevelopment is capable to remove both exposed and unexposed sites, therefore play with developer concentration to reach development time within 1-3min. Take the board out of developer and hold under running water (room temperature) to check the pattern. You can always put it back in the developer if needs more developing time. Carefully rinse the board and dry the remaining photopolymer in a 100°C oven for 5 minutes. Do not leave the board in the oven too long or you will never get the photopolymer off if you need to. ? 5. Etch PCB using standard etcher, rinse it with plenty of water. ? 6. Remove processed photoresist: Dissolve remover in warm tap water (KOH, NaOH 1-5%wt. depending on desired removal speed), place your processed PCB into solution. Use soft brush to speed up removal. When removal process is complete rinse your PCB with running water and then let it dry. Your imaged board is now ready for further processing.

Condition:	New: A brand-new, unused, unopened, undamaged item in its original packaging (where packaging is applicable). Packaging should be the same as what is found in a retail store, unless the item is handmade or was packaged by the manufacturer in non-retail packaging, such as an unprinted box or plastic bag. See the seller's listing for full details. ...	Brand	DuPont Riston
Model	FX-515