6 - Iti Used Metal Bonded Diamond Saw Dicing - Wafer Cutting Blades

US $160

  • Saint Louis, Missouri, United States
  • Jan 30th
6 - Used condition metal bonded diamond dicing - wafer cutting blades. 2.750 insde diameter .034 thick 4.200 outside diameter or larger. Made by Industrail Tools inc.
Condition Used :
An item that has been used previously. The item may have some signs of cosmetic wear, but is fully operational and functions as intended. This item may be a floor model or store return that has been used. See the seller’s listing for full details and description of any imperfections.
Seller Notes used condition

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