Buehler Minimet 1000 Polisher

US $14000

  • Cleveland, Ohio, United States
  • Jan 30th
Minimet 1000 can be used for precision thinning and mirror polishing required for different applications, e.g., polishing of small wafers. To remove material, the specimen is placed on a variably loaded arm that moves in a circular geometric pattern bounded by a stationary polishing bowl. Material removal is done by a grinding disc, or by a combination of abrasive/lapping/polishing cloth and glass backing disk, placed on the bottom of the bowl. The user can control the speed of the arm motion from 0 to 50 rpm, the force of the arm from 0 to 10 lb, and the polishing/grinding duration. A variety of diamond grinding disks, abrasive papers, polishing powders and suspensions, lapping films, and polishing cloths can be used. Unit is offered AS-IS, with the items pictured.

Directions

Similar products from Cachets & Wafers

People who viewed this item also vieved

By clicking "Accept All Cookies", you agree to the storing of cookies on your device to enhance site navigation, analyze site usage, and assist in our marketing efforts.

Accept All Cookies