Dynamask 5000 Dry Film Solder Mask For Pcb, 30cm X 2 Meters Roll

US $49.99

Multiple warehouses across the Europe, Sweden
Mar 4th

Open on mobile:
QR code

This listing is for roll of Dry Film Solder Mask from Rohm & Haas 30cm x 2 meters, approx. size (12x79in), 3mil (75 microns) mask layer thickness. It is Negative type which means it should be treated in the same way as dry film resists. Dry film solder mask becomes very popular replacement of liquid solder masks because of its technological similarity to the conventional dry film photoresists. It requires the same equipment and the same chemistry as dry film resists but gives better reproducibility and mask thickness uniformity. Dynamask 5000 series is aqueous processible Dry film solder mask based on epoxy chemistry materials. It is fully compatible with the aqueous fluxes and solder pastes. Same as the other dry film resists, Dynamask 5000 is supplied sandwiched between 1mil polyester and polyolefin release transparent films. The shelf life is 6 months at room temperature (+20 deg.C) or 5 years in the fridge at +5 deg.C. The item is shipped as rolls. If you need plane sheets (6x8in or 8x12in) as well as supplementary chemistry (alkaline developer) please check my other listings or contact me. Multiple quantity of the same item is available. Questions are welcome. Due to the nature of product we don't combined shipping on this item with the other type of items, it is sold as is with no return. Expedited shipping is worldwide. Expedited shipping includes insurance and tracking. Payment is due within 3 days. Buyer is responsible for all local taxes and customs fees whenever applicable. We ship from multiple warehouses across the Europe depending on availability of product. Please check out my other items! and thanks for looking. Application and processing: Many dry film products are supplied as a laminate consisting of two to three layers. In the case of epoxy photopolymers (e.g. Dynamask 5000), there are three layers; a peel sheet (or release-liner), the resist film, and a ultraviolet (UV) transparent cover sheet. Peel sheet: A polyolefin release liner that covers the thermally active adhesive on the bottom of the photopolymer. This layer is typically automatically removed (stripped) by the laminator immediately prior to lamination (it can be manually removed with a piece of scotch tape attached to the corner of photoresist laminate). Resist Solder Mask film: A UV curable, aqueous-developable, super-viscous-liquid epoxy film. Cover sheet: The outer covering of the multilayered film is usually made of heat resistant polyester (PET, a.k.a. Mylar). Since it functions as an oxygen block (see below) as well as a protective layer, it should remain in place on the outer layer of the resist until the board is ready to be developed. The cover sheet should be left in place at least 15 minutes after exposure and should only be removed immediately prior to developing. Operating notes: Always wear gloves when cleaning and handling copper clad prior to dry-film lamination Dry-film lamination must be performed under incandescent or UV-proofed fluorescent lights. Store laminated boards in a light-tight enclosure if they will not be processed immediately. How to use Dynamask 5000: ? 1. Preparation: Clean your PCB using one or more standard techniques. Cut dry film to size of your board dimensions. ? 2. Apply Solder Mask: This Solder Mask has 3 layers, the top and bottom layers are clear protective layer, so at the first, you need remove one protective layer, the easy way is to use two small pieces of scotch tape attached to opposite sites. Polyolefin protective layer peels off first. Then apply the middle layer on top of your PCB using either hot (pouch) laminator or manually. a) Apply using a hot roll laminator. This is the easiest and professional way to do it. You may find some video instructions here: https://www.youtube.com/watch?v=y_LJ1W3DolM&list=PLZOFj3kVAeqn3Izkl4NthSq6_4MzN7U1M&index=2 b) Apply manually. Starting from one corner and ending to the cross corner, use your fingers, rubber roll or palm to remove all air bubble between film and board. Some techniques suggest using wet lamination. Wet lamination works better but requires more attention to water layer thickness and settlement time after application. Set the iron temperature about 115-125°C (105-110°C for wet lamination). You can play around temperature and laminator sets to get your best results (there is no universal recipe, you will have to find your own). Apply the hot iron down onto the film and PCB, pressing them to make a good flat contact. It’s good idea to have a Teflon or Viton rubber sheet between iron and your PCB. It makes more uniform pressure distribution. After hot lamination please allow PCB to cool down slowly and give some time to settle. ? 3. Solder Mask Imaging: Place your negative artwork over the rest protective layer. Use the plane glass to press your artwork to the PCB, then expose to UV light source (sunlight works as well). It’s recommended the source of light to be at least 12" away from the artwork. Before actual exposure you need to calibrate your light source in order to find the correct exposure time window which is dependent upon intensity and radiation spectrum as well as photoresist sensitivity. Both underexposure and overexposure have impact upon photoresist resolution. After exposure carefully remove the artwork (DO NOT REMOVE THE MYLAR COVER SHEETS!) and let the board sit for at least 15 minutes in a cool, UV safe area. Dry-film photopolymers used in the printed circuit industry (e.g. photoresist, solder masks etc) are exposed using ultraviolet (UV) radiation in the range of 300 nm (nanometers) to 410 nm. For the home shop, a much smaller system is usually adequate. Since throughput is a secondary concern, the radiant output can be much lower and still provide acceptable performance. Two things that cannot be traded off, however, are source collimation and uniformity of illumination. Source collimation, or the degree of parallelism with which the UV light illuminates the artwork/sensitized substrate, ultimately determines the fidelity of image transfer and the minimum size feature that can be reliably resolved. With most practical light sources, there is always going to be a tradeoff between collimation and the total radiant flux reaching the photoresist. At one extreme, you could place your source at infinity (or pretty far away if infinity is out of the question) and achieve a very high degree of collimation. The inverse square law, of course, would reduce the total amount to light actually striking your laminated copper clad to next to nothing, so exposure times on the order of millennia might be expected. At the other extreme, you could put the source right up against the board being exposed to achieve very short exposure times, but, the divergence of the incident light would be so extreme that resolving fine details would be impossible. Uniformity of illumination determines the consistency of exposure from one point to another and affects the trace-width uniformity in the developed image. From a uniformity point of view, the ideal source would be an isotropic emitter whose emission area was as large as, or larger than the substrate you are imaging. Any light source intended for use in PCB production must strike an acceptable balance between these two factors and the cost of implementation. ? 4. Develop: Remember: you need NEGATIVE dry film developer (sodium or potassium carbonate (monohydrate) Na2CO3 or K2CO3). Carefully peel off the Mylar cover sheet(s) and develop the board in the developer solution that is mixed by 1g developer powder with 90-100ml of water (~1.1% by weight). It’s recommended to heat up developer solution to 30-35°C in order to speed up development time. Remember that overdevelopment is capable to remove both exposed and unexposed sites, therefore play with developer concentration to reach development time within 2-4min. Take the board out of developer and hold under running water (room temperature) to check the pattern. You can always put it back in the developer if needs more developing time. Carefully rinse the board and dry the remaining photopolymer in the oven at 100°C for 5 minutes. Do not leave the board in the oven too long. ? 5. Post cure your Solder Mask pattern in powerful UV light. There is a "golden rule" about UV post curing: it should be at least 3-5 time longer than your exposure time. I would recommend at least 30min post curing time. ? 6. Post bake your Solder Mask in the oven at 145-150°C for approximately 1 hour and then cool down slowly. Don't overbake your pattern. Your imaged board is now ready for further work. More application information you can Google on electronics forums and check the videos on Youtube like here: https://www.youtube.com/watch?v=uSKXDNJ_peo&list=PLZOFj3kVAeqn3Izkl4NthSq6_4MzN7U1M&index=7

Condition:	New: A brand-new, unused, unopened, undamaged item in its original packaging (where packaging is applicable). Packaging should be the same as what is found in a retail store, unless the item is handmade or was packaged by the manufacturer in non-retail packaging, such as an unprinted box or plastic bag. See the seller's listing for full details. ...	Brand	Dynamask
Model	5000