Electroglas Xynetics EG1034X Wafer Die Prober Probe Station &Power Supply, US $1,000.00 – Picture 0

Electroglas Xynetics EG1034X Wafer Die Prober Probe Station &Power Supply, US $1,000.00 – Picture 1

Electroglas Xynetics EG1034X Wafer Die Prober Probe Station &Power Supply, US $1,000.00 – Picture 2

Electroglas Xynetics EG1034X Wafer Die Prober Probe Station &Power Supply, US $1,000.00 – Picture 3

Electroglas Xynetics EG1034X Wafer Die Prober Probe Station &Power Supply, US $1,000.00 – Picture 4

Electroglas Xynetics EG1034X Wafer Die Prober Probe Station &Power Supply, US $1,000.00 – Picture 5

Electroglas Xynetics EG1034X Wafer Die Prober Probe Station &Power Supply, US $1,000.00 – Picture 6

Electroglas Xynetics EG1034X Wafer Die Prober Probe Station &Power Supply, US $1,000.00 – Picture 7

Electroglas Xynetics Eg1034x Wafer Die Prober Probe Station &power Supply

US $1,000.00

Scotts Valley, California, United States
Jan 30th

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I have a prober recently removed from service, selling as is for rebuild or parts. Specifications: Die Prober Test Station Condition: Used Input Power: Volts: 115 Phase: 1 Hertz: 60 FLA: 6 PSI: 85 X-Y Travel: 6 inch probing, 5 inch load/unload Index Range: 0.0005 to 5.9999 in. Resolution: 0.005/0.00025 in. Accuracy: +/- .0005 in. Repeatability: +/- .0001 in. Electrical: 110VAC, 60Hz, 1P Air: 2.5 cfm at 85 psi Vacuum: 18 to 25 inches Hg (457 to 635 mm) Dimensions (in.):30"x28"x18" for Prober and 21"x14"x7" for Power Supply. Est. Weight: 300 lbs for Prober and 35 pounds for Power supply. The ELECTROGLAS Model 1034X Automatic Wafer Probe is a precision instrument for testing and classifying semiconductor devices in wafer form. The Model I034X is a self-nontained system comprising two modules, a probe module and a power module. Both modules are designed for compact bench-top mounting; however, an interconnecting cable permits remote mounting of the power module when desired. The ELECTROGLAS 1034X is designed for operational simplicity and fast wafer throughput. The unique ELECTROGLAS solid-state high-speed X-Y Positioning System permits simplified wafer loading and unloading outside the probe ring area with high-speed travel to and from the load position. Simplified manual and semi-automatic controls assure rapid wafer alignment by automatic gross positioning, simplified theta alignment, and precise device alignment by use of a multi-function joystick that provides 20 different manual commands in a single control. The high-speed automatic probing cycle provides automatic indexing, probing and inking of all devices on the wafer under preprogrammed indexing control, and automatic return to the load position when probing is complete. The system accommodates up to 4-inch (102-mm) wafers and provides indexing in either English or Metric system units

Condition	For parts or not working : An item that does not function as intended and is not fully operational. This includes items that are defective in ways that render them difficult to use, items that require service or repair, or items missing essential components. See the seller’s listing for full details.
Seller Notes	“exact condition unknown, and not an expert on this part, so sold as a parts tool”