New Rvsi Vanguard Vai 6300 Ball Placement System For Semiconductor Production

US $29,500.00

  • Fountain Valley, California, United States
  • Jan 30th
Brand New Unit Still in the Crate. The Govenment paid over $300,000.00 for it in 2000 never used it.  Call Jim for more info 714 6121480 The VAi 6300 Ball Placement System offers the ability to process semiconductor packages with the lowest possible cost of ownership of any ball placement system available today. It supports a wide variety of BGA formats including single devices in boats or trays and strip devices in magazines with the capability to process chip-scale packages, plastic ball grid array, ceramic ball grid array, tape ball grid array, and connector packages Machines such as Vanguard's are placement-dedicated, that is, they are specific to the placement process and do not include ovens for the reflow process„ a component of ball attach. Ovens, however, are added inline. With few variations, all other equipment makers use a vacuum-pin approach to pick-and-place the solder balls onto the packages. That method, according to McGill, "greatly limits the substrate area and I/O that may be processed in a single cycle." Vanguard employs a screen-printing gravity method that allows all balls to be placed on every pad in one cycle, regardless of the number of devices being processed or the I/O of the devices. McGill also claims that the Vanguard VAi 6300 system is the only one currently available that can be field upgraded from semi-automatic to fully automatic, high-volume processing.

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