100g Nc-559-asm Bga Pcb Smt Ic Reballing Soldering Fast Greas Flux Paste B9c8

US $9.95

  • shanghai, China
  • Jul 12th
Description description: 100% new high quality NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIR Recommended for BGA, CSP and other solder ball array repair and fill the ball When using smoke less, no residue. Affordable. Color as shown Rework help paste applied to mobile phone PCB, BGA and SMD's PGA etc. It's used in low ionic activator system, tin-run speed Low level of smoke,surface insulation resistance value is high residue after curing Therefore, the electrical properties of the cell phones and other communications products, very little interference Uses: Suitable for:North and south bridge, cards, cell phone chip, video chip BGA solder, bumping Also can use off the tin, the effect is very ideal The residue was less bright spot, less smoke, no pungent odor, do not run the ball Packing: 1PCS x NC-559-ASM Soldering Paste or 1PCS xRMA-223-UV Soldering Paste
Condition:
New: A brand-new, unused, unopened, undamaged item in its original packaging (where packaging is applicable). Packaging should be the same as what is found in a retail store, unless the item was packaged by the manufacturer in non-retail packaging, such as an unprinted box or plastic bag. See the seller's listing for full details. ...
Features Array
Country/Region of Manufacture China
Brand Unbranded
Type as shown
MPN Does Not Apply

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