100g Nc-559-asm Bga Pcb Smt Ic Reballing Soldering Greas Paste Flux Fast U4g7

C $10.71

shanghai, China
Aug 26th

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NC-559-ASM is also versatile enough to be used with a variety of components, including North and south bridges, cards, cell phone chips, video chip BGA solder, and bumping. Plus, when you use it, you'll notice less bright spots, less smoke, and no pungent odor - so there's no need to worry about running the ball. With its low ionic activator system and tin-run speed, NC-559-ASM is perfect for use in mobile phone PCB, BGA, and SMD's PGA repairs. It produces low levels of smoke and has high surface insulation resistance value after curing, which means you'll experience minimal interference with electrical properties in your cell phones and other communications products. If you're looking for an even more targeted solution, you can also try 1PCS xRMA-223-UV Soldering Paste. Either way, you can trust that you're getting affordable, top-quality soldering paste that will make your repairs easy and efficient. Looking for high-quality soldering paste to help with your BGA, CSP, and other solder ball array repairs? Look no further than 100g NC-559-ASM BGA PCB SMT IC Reballing Soldering Greas Paste Flux Fast U4G7. This 100% new, high-quality paste is specially designed to leave very little residue and has a very high value of Surface Insulation Resistance (SIR) thanks to its light color.

Condition:	New: A brand-new, unused, unopened, undamaged item in its original packaging (where packaging is applicable). Packaging should be the same as what is found in a retail store, unless the item was packaged by the manufacturer in non-retail packaging, such as an unprinted box or plastic bag. See the seller's listing for full details. ...	Features	Array
MPN	Does Not Apply
Brand	Unbranded
Country/Region of Manufacture	China