1999 Esec 2007 Ic-8 Automatic Die Bonder

US $19,500.00

  • Huntington Beach, California, United States
  • Jan 30th
NOMINAL SPECS  PLEASE CONFIRM Esec 2007 IC-8 Automatic Die Bonder, Max. Chip Size-25.4 x 25.4mm, Wafers Up To 8" Dia., Programmable Dispensor, Max. Dispensing Area-25 x 25mm, Die Size Range-2 x 2mm - 20 x 20mm, Top Stack Loader, Quality Control Camera, Pick & Place System, Magazine Holder, Programmable Controls Full set of Manual Books System Disk in Floppy

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