.8mm thick .031 or .032 about in inches MELTS a little lower, very easy to work with, perfect for soldering electronic component boards! 1oz AS PICTURED! hand rolled , not perfectly wound, but very easy to use!......so we can sell it cheaper, as pictured. best deal on ebay! PLEASE VIEW MY STORE ITEMS HERE Solder) is a fusible metal alloy used to join together metal workpieces and having a melting point below that of the workpiece(s). Soft solder is what is most often thought of when solder or soldering is mentioned and it typically has a melting range of 90 to 450 °C (190 to 840 °F). It is commonly used in electronics and plumbing. Alloys that melt between 180 and 190 °C (360 and 370 °F) are the most commonly used. By definition, using alloys with melting point above 450 °C (840 °F) is called 'hard soldering', 'silver soldering' or brazing. Soft solder can contain lead and flux but in many applications lead free solder is used. Perhaps the most common and most familiar form of solder is as a wire or rod, though plumbers often use bars of solder while jewelers often use solder in thin sheets which they cut into snippets. Solder can also come in a paste or as a preformed foil shaped to match the workpiece. The word solder comes from the Middle English word soudur, via Old French solduree and soulder, from the Latin solidare, meaning "to make solid".[3] Eutectic alloys melt at a single temperature. Non-eutectic alloys have markedly different emperature, and within that range they exist as a paste of solid particles in a melt of the lower-melting phase. The pasty state causes some problems during handling; it can however be exploited as it allows molding of the solder during cooling, e.g. for ensuring watertight joint of pipes, resulting in a so called 'wiped joint'. With the reduction of the size of circuit board features, the size of interconnects shrinks as well. Current densities above 104 A/cm2 are often achieved and electromigration becomes a concern. At such current densities the Sn63Pb37 solder balls form hillocks on the anode side and voids on the cathode side; the increased content of lead on the anode side suggests lead is the primary migrating species.[4 Contact with molten solder can cause 'solder embrittlement' of the materials, a type of liquid metal embrittlement. Tin/lead solders, also called soft solders, are commercially available with tin concentrations between 5% and 70% by weight. The greater the tin concentration, the greater the solder’s tensile and shear strengths. At the retail level, the two most common alloys are 60/40 Tin/lead (Sn/Pb) which melts at 370 °F or 188 °C and 63/37 Sn/Pb used principally in electrical/electronic work. The 63/37 ratio is notable in that it is a eutectic mixture, which meansIt has the lowest melting point (183 °C or 361.4 °F) of all the tin/lead alloys; ande melting point is truly a point — not a range. In plumbing, a higher proportion of lead was used, commonly 50/50. This had the advantage of making the alloy solidify more slowly, so that it could be wiped over the joint to ensure watertightness, the pipes being physically fitted together before soldering. Although lead water pipes were displaced by copper when the significance of lead poisoning began to be fully appreciated, lead solder was still used until the 1980s because it was thought that the amount of lead that could leach into water from the solder was negligible from a properly soldered joint. The electrochemical couple of copper and lead promotes corrosion of the lead and tin, however tin is protected by insoluble oxide. Since even small amounts of lead have been found detrimental to health lead in plumbing solder was replaced by silver (food grade applications) or antimony, with copper often added, and the proportion of tin was increased (see The addition of tin improves wetting properties of the alloy; lead itself has poor wetting characteristics. Tin however increases the cost of the solder. High-tin tin-lead alloys have limited use as the workability range can be provided by a cheaper high-lead alloy. In electronics, printed circuit boards use solder joints to mount components and create a circuit. For miniaturised PCB joints with surface mount components, solder paste has largely replaced solid solder. Lead-tin solders readily dissolve gold plating and form brittle intermetallics. Sn60Pb40 solder oxidizes on the surface with forming complex 4-layer structure: tin(IV) oxide on the surface, below it a layer of tin(II) oxide with finely dispersed lead, below a layer of tin(II) oxide with finely dispersed tin and lead, and the solder alloy itself underneathSome alloys, namely of lead and to some degree tin, contain small but significant amounts of radioisotope impurities. The radioisotopes undergoing alpha decay are a concern due to their tendency to cause soft errors. Polonium-210 is especially problematic; lead-210 beta decays to bismuth-210 which then beta decays to polonium-210, an intense emitter of alpha particles. Uranium-238 and thorium-232 are other significant contaminants of lead containing alloys [edit] Lead-free solder On July 1, 2006 the European Union Waste Electrical and Electronic Equipment Directive (WEEE) and Restriction of Hazardous Substances Directive (RoHS) came into effect prohibiting the intentional addition of lead to most consumer electronics produced in the EU. Manufacturers in the U.S. may receive tax benefits by reducing the use of lead-based solder. Lead-free solders in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free replacements for conventional Sn60/Pb40 and Sn63/Pb37 solder have melting points from 5 to 20 °C higherthough solders with much lower melting points are available. Drop-in replacements for silkscreen with solder paste soldering operations are available. Minor modification to the solder pots (e.g. titanium liners or impellers) used in wave-soldering operations may be desired to reduce maintenance costs associated with the increased tin-scavenging effects of high tin solders. Since the properties of lead-free solders are not as thoroughly known, they may therefore be considered less desirable for critical applications, like certain aerospace or medical projects. "Tin whiskers" were a problem with early electronic solders, and lead was initially added to the alloy in part to eliminate them. Sn-Ag-Cu (Tin-Silver-Copper) solders are used by two thirds of Japanese manufacturers for reflow and wave soldering, and by about 75% of companies for hand soldering. The widespread use of this popular lead-free solder alloy family is based on the reduced melting point of the Sn-Ag-Cu ternary eutectic behavior (217 ?C), which is below the Sn-3.5Ag (wt.%) eutectic of 221 °C and the Sn-0.7Cu eutectic of 227 °C (recently revised by P. Snugovsky to Sn-0.9Cu). The ternary eutectic behavior of Sn-Ag-Cu and its application for electronics assembly was discovered (and patented) by a team of researchers from Ames Laboratory, Iowa State University, and from Sandia National Laboratories-Albuquerque. Much recent research has focused on selection of 4th element additions to Sn-Ag-Cu to provide compatibility for the reduced cooling rate of solder sphere reflow for assembly of ball grid arrays, e.g., Sn-3.5Ag-0.74Cu-0.21Zn (melting range of 217–220 ?C) and Sn-3.5Ag-0.85Cu-0.10Mn (melting range of 211–215 ?C). Tin-based solders readily dissolve gold, forming brittle intermetallics; for Sn-Pb alloys the critical concentration of gold to embrittle the joint is about 4%. Indium-rich solders (usually indium-lead) are more suitable for soldering thicker gold layer as the dissolution rate of gold in indium is much slower. Tin-rich solders also readily dissolve silver; for soldering silver metallization or surfaces, alloys with addition of silvers are suitable; tin-free alloys are also a choice, though their wettability is poorer. If the soldering time is long enough to form the intermetallics, the tin surface of a joint soldered to gold is very dullFlux is a reducing agent designed to help reduce (return oxidized metals to their metallic state) metal oxides at the points of contact to improve the electrical connection and mechanical strength. The two principal types of flux are acid flux, used for metal mending and plumbing, and rosin flux, used in electronics, where the corrosiveness of acid flux and vapors released when solder is heated would risk damaging delicate circuitry. Due to concerns over atmospheric pollution and hazardous waste disposal, the electronics industry has been gradually shifting from rosin flux to water-soluble flux, which can be removed with deionized water and detergent, instead of hydrocarbon solvents. In contrast to using traditional bars or coiled wires of all-metal solder and manually applying flux to the parts being joined, some light hand soldering since the mid-20th century has used flux-core solder. This is manufactured as a coiled wire of solder, with one or more continuous bodies of non-acid flux embedded lengthwise inside it. As the solder melts onto the joint, it frees the flux and releases that on it as well. Hard solders are used for brazing, and melt at higher temperatures. Alloys of copper with either zinc or silver are the most common. In silversmithing or jewelry making, special hard solders are used that will pass away assay. They contain a high proportion of the metal being soldered and lead is not used in these alloys. These solders vary in hardness, designated as "enameling", "hard", "medium" and "easy". Enameling solder has a high melting point, close to that of the material itself, to prevent the joint desoldering during firing in the enameling process. The remaining solder types are used in decreasing order of hardness during the process of making an item, to prevent a previously soldered seam or joint desoldering while additional sites are soldered. Easy solder is also often used for repair work for the same reason. Flux or rouge is also used to prevent joints from desoldering. Silver solder is also used in manufacturing to join metal parts that cannot be welded. The alloys used for these purposes contain a high proportion of silver (up to 40%), and may also contain cadmium. ACCEPT PAYPAL, CHECK, CASH or MONEY ORDERS. NO INTERNATIONAL SHIPPING NO SHIPPING TO APOs Froo www.froo.com | Froo Cross Sell, Free Cross Sell, Cross promote, eBay Marketing, eBay listing Apps, eBay Apps, eBay Application Please inquire about BULK PURCHASES, LARGER ORDERS or any MULTIPLE QUANTITIESand we'll get back to you PROMPTLY with a quote!!!!! approximately 23 feet length PLEASE be sure you know what you're buying, not responsible for wrong fit, etc. IF not sure, message us first, if need to return parts that don't fit or don't need, there will be a 25% restock fee and you will pay for the return shipping costs, NO EXCEPTIONS!!!!!!!!!
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