5 Pcs 16w 600ma White Round Cob Smd Led Light 32pcs Clips

US $43.90

shenzhen, China
Jan 29th

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[zipedit] Package Include: 16W 600mA White Round COB SMD LED Light 32pcs Clips x 5pcs Luminous Flux:70-85LM/W Voltage:24-27V Current:600mA dimension:?49mm Description: The COB LED has good thermal performance, long lifetime, and lower power loss. Heat dissipation is good and easily manageable. Only about 30% heat of High Power LED. Among different LED components such as high power LED, SMD, dip etc, COB LED is best in less thermal resistance and cooling. COB LED is better lighting effect, it is no dizzy, no uncomfortable glare, no zebra strips. When it light up, it looks smooth and like a lighting panel. However, the SMD, HP, 5mm LED is heavy dizzy, uncomfortable glare, heavy zebra strips. When it is light up, it looks dots. A Milky or diffused cover can improve, but at the same time it cause light loss. Specification: LED chip is fixed on aluminium layer of aluminium base PCB. The heat from chip can be spread out through aluminium layer rapidly Low lighting decay,decay less than 1% after 2000 hours Equable and soft irradiancy , no glaring and eye protection. Good reliability, no dead bulb and no motting. LED fill lighting module can be combined into different LED lights easily. Safe,work voltage is under 50V. Environment friendly. Tips: The chip-on-board technology (abbreviated COB) is a technology for direct mounting of unpackaged semiconductor chips on circuit boards to an electronic assembly . Today, one uses the term COB for all modules that bare the containing semiconductors, while including originally understood only assembly with chip-and-wire technique. Mounting options: During the assembly of bare semiconductor chips between two variants: Direct Chip Attach - the chip is mounted directly on the substrate; Tape Automated Bonding - technique, in which the chip is assembled on an intermediate carrier, which in the finished assembled assembly that connects to the substrate. The first type of installation direct chip attach , so the direct mounting of unpackaged semiconductor chips on the wiring substrate , can be done using different techniques: Either by using the chip-and-wire technology, wherein the chip directly bonded to the circuit board and by means of wire bonding is electrically connected with the conductor network. Thereby, the contact surfaces of the chips are located on the side facing away from the circuit board side of the chip. Or mounted to the chip by using the flip-chip technology , wherein before connecting to the contact surfaces of the chip applied solder balls or conductive plastic hill the chip with the wiring substrate electrically and mechanically. The contacts of the chips are thereby facing the circuit board. Steps for direct mounting chip-and-wire technique: Chip bonding : Identifies the placement and bonding of such components on the carrier. Wire bonding : The connection of the wires ( gold , aluminum , rare palladium , copper) from the chip to the carrier (PCB / PCB, ceramic, flex print, glass, other). Chip Encapsulation (English glob top ): The shedding of the contacted chips. In the second variant, Tape Automated Bonding , the chip is assembled on an intermediate carrier and wiring together therewith is mounted on the printed circuit board. Pros and Cons: The advantage of this technology to higher yields frequency due to shorter distances between the chip and the PCB. Furthermore, there is a better thermal connection between the chip and the circuit board, in this case the molding compound also contributes to heat dissipation in the circuit board. Compared to chips in the housing uses less space, which enables a higher integration density of the circuit board. In large-scale process, this technology can be produced inexpensively. In addition, with this technology by parallel connection of multiple bond wires a low electrical resistance were carried out, in the field of power electronics results in lower thermal losses. The disadvantages arising from this technology, the inability of a repair of a defective chip. Furthermore, the processing of these components is a clean room (largely dust-free and air-conditioned) are required. Application : Apply the chip-on-board technology in high-volume and low-cost applications ( watches , calculators ). 1996, it was assumed that in 2000 15% of all manufactured ICs were mounted using the chip-on-board technology. The percentage of using the chip-on-board technology manufactured electronic components at all manufactured worldwide Assemblies in 1995 amounted to just 0.1%.