Design Square-Micro allows you to solder all SMD chip sizes by up to BGA. Soldering process occurs on board local area, which avoids the heat impact of the surrounding elements. However, the software used allows soldering on boards both small and large. There are no analogues of this equipment in the price range of up to 1500 USD never released. The station is not in any Chinese clone with industrial controllers. All circuits and equipment control software of its own design unit. The program tried to accommodate as much as possible the decisions emanating from the experience of the actual soldering conditions of the service center. The station may be modified, and makes it possible to replace the lower heating element to a larger size if necessary. The control unit thus does not require replacement. Suffice using coefficients configured to work with the new lower heater. To replace the heater will need to unscrew the 6 screws. Load unit for the bottom of the heater must not exceed 2 kW (eg if you use your own heating element). You can use, and more power, but it may be necessary to install additional cooling fan (mounting holes are provided on the load of the control unit. Provided and fan connection socket. Or, on the contrary the vents you can install any other fan). Manage your bottom heater can be done by connecting to the connector on the load control unit. So you get any configuration soldering equipment. This form factor we used the original scheme of fixing the control panel. The control panel is fixed directly to the upper heater. Such control schemes we have not seen on any of the designs soldering stations. The scheme showed undoubted convenience. On the control panel connector is to connect the USB cable (for now to simplify the procedure for firmware updates). In this connection the data transmission of the current temperature. On reaching complete table can be accommodated as small and large boards. At the same time a large amount of the fee, which is located on the M3 rack (thin end), the board of small dimensions are accommodated using the bundled holders. Move the fixed fee for a more accurate positioning by means of linear bearings. In addition you can use the site to consolidate the units of small size boards. This area can be easily mounted on the guide table. In place of soldering with the help of a gib attached sensor. The clip is strong enough no stickers metal foil (like the Chinese station for example) is required. The clamp is designed simply and reliably. If necessary, height adjustable. After installation in the place of soldering is secured with a screw ram. Needless mount the temperature sensor can be mounted on a separate guide (optional), which provides even more convenient to use. This all comes in the format of a table, there is no separate brackets. All moves to some guides as interconnected, and separate when setting up. The new technology of soldering BGA chips and SMD components. A very promising solution to reduce board size, taking into account the entire current produced electronic engineering. We have moved away from the traditional scheme for soldering stations using lower heating quartz heating element size 62х62 mm. Almost bottom became little more than a soldered chip. This scheme has shown its full vitality and work with any chips. It should be noted extreme care in soldering (enabled only required for soldering the board section). Are used as heating elements - quartz infrared heaters. This is absolutely not what are the quartz lamps. Quartz heater uses invisible infrared range (heat) waves of 2-22 microns. Therefore, no emission, virtually none. Quartz heater device is very simple. Qualitative or chromium stacked in a spiral quartz tube. Quartz is very good passes infrared radiation and conducts heat. Besides the heater body is made of mirror stainless steel. As a result, the entire radiation flux is reflected directly from the source. From ceramic heaters that does not happen, so the stations with ceramic heating elements heat up considerably on constructive. In the case of infrared quartz heating elements surrounding structural elements is minimal. This allows a more economical use of energy. Besides quartz heating elements less inertia (more rapidly heated and cooled). When we conducted the experiments, we noticed that the heating element of the ceramic 80x80 (capacity 400 watts) is inferior to the real thermal influence on the soldering infrared quartz heater capacity of 250. About the inertia can not even speak. The heated ceramic is much more a long time to heat up and cool down, which increases the risk of overheating (soldering profile in the final phase) and subcooling in the initial phase (at the beginning of the solder after heating fee). The main decision was the station works in conjunction bottom heater and heater overhead, this copes control unit. Control panel (of course english version). For all the information shown on the display control panel. Set the soldering profile, soldering mode, the power of the upper and lower heaters, the temperature of the bottom heater and solder joints, the required temperature solder joints. The control panel contains controls all unit. In addition we have implemented the ability to dynamically (in the already ongoing soldering) changes in the profile (such as not removing the chip to 230 degrees is possible without changing the profile itself simply by pressing "+" and "-" to increase the temperature for example up to 240 degrees in the process. profile reconstructed itself.) Implemented work in four modes: Mode STATION (8 programmable profiles) Mode of operation of the upper heater (3 programmable profiles) The operating mode HEATING (3 programmable profiles) Mode reballing (4 programmable profile) (an experimental yet) Operating mode MANUAL (manual power upper and lower heaters) In the control unit are 8 profiles, which you can program yourself. Two profiles are already configured on the average lead-free solder and soldering lead containing solders. All programming is absolutely clear and transparent. And it consists of a choice of 6 menu items for each profile. Select the intended melting temperature. Select Profile soldering factor. This factor is part of a calculation of the temperature. By increasing the ratio graph of temperature rise becomes steeper with decreasing flatter. Allowing you to change the time and intensity of the heat. At the same time you do not need to install both the Chinese plants such as shelves profile. In this case, the temperature is calculated by the formula. The graph is a parabola branch. Selecting a lower temperature of the heater. Selecting a profile factor of the lower heater. Similarly, paragraph 2. Temperature switch on the upper heater. It can be set to turn on the heater to achieve the desired temperature solder joints. Enables or disables the lower heater temperature control mode. This option enables you to either in packs to keep the desired temperature (in paragraph 5), or the temperature control board directly via the lower temperature of the heater. For example someone like best when slightly heated soldering soldering bottom place simultaneously producing heat with the top heater (in this case, the control should be disabled). So you can customize yourself any of the 8 profiles. The upper heater mode, you only work the upper heater. Lower heater is not activated. This option can be used to remove or install small chips or plastic connectors soldering surface. A special feature is the lack of air flow and accuracy of heating. In HEATING mode, you only work the lower heater. This you can withdraw in the direction of the upper heater has to work directly and only to the board and the lower heater if necessary. This mode can be activated surely and upper sensor. The preheating function (if the control options on the top) and directly to an information (for viewing the place of soldering the current temperature). And to use such a conventional air dryer. This fee will be located on the lower heater heated to a temperature of the order you want, and you already have an air-dryer produce soldering. Reballing mode is passed experimental stage (determined by the parameters of the heaters). Of course the operation itself reballing now can produce and two previously described modes of operation of the station. MANUAL MODE - this mode we have not seen in any of the stations (such as Chinese clones). With this mode, we can fully manually adjust the operation of heaters. For this you enable the "+" and "-" to lower the heater button "K1" and "K2" for the upper heater. Manually setting the power of each of the heaters. It is natural that the heater is turned off at zero power. So you can use the heater both separately and together in a manual mode. FUNCTION Afterrun In addition to our plant first appeared Afterrun function (our name). This feature lets you produce Afterrun lower heater at the final stage of soldering. For example: you heat the lower part of board up to 90 degrees in the place of soldering, and then turns on the upper heater bottom heater at the same time keeps its own temperature level of 90 degrees on the board. With this power saving mode to the bottom of the solder there is a danger when you reach the place of soldering temperature of 180 degrees (for example) and above the upper heater to overheat due to subcooling bottom. You specify in the profile (if configured) that Afterrun enabled, indicates the temperature at which the function is activated (eg 180 degrees), and specify how many degrees to increase the bottom heater temperature (eg 40 degrees). Then, when the temperature reaches 180 degrees activated donagrev and lower heater board temperature increase below facilitate the work of the upper heater. This enhanced thermal effect on the bottom board is the minimum time and help to avoid thermal damage to the soldered boards. Of course the settings are saved for each profile. This feature is completely missing in the sold in the soldering station market. At the same time it showed complete ease and accuracy in the soldering. Setting it clear and simple. The function created by us for quality of rations provided hard soldered boards. The board is placed on the table. The top heating element rotates around its own axis and is located just above the lower heater. The design is simple. It does not take up much space and mobility. The top heating element Rated power of the quartz infrared radiator 250 WATT The size of the working surface of 62x62 mm Maximum radiator temperature of 700 degrees Celsius Wavelength IR radiation 2-22 mkm The degrees of freedom of up and down around the axis Lower heating element Rated power of the quartz infrared radiator 250 WATT The size of the working surface of 62x62 mm Maximum radiator temperature of 700 degrees Celsius Wavelength IR radiation 2-22 mkm The degrees of freedom can be replaced Rated power of the quartz infrared radiator 250 WATT The size of the working surface of 62h62 mm Maximum radiator temperature of 700 degrees Celsius Wavelength IR radiation 2-22 m The degrees of freedom can be replaced Station Management Power supply station 220-230 V 50 Hz Operating temperature of 15 to 40 degrees Celsius Power consumption with a standard bottom heater 510 WATT Equipment: Stand with the upper heater and the load control unit 1 pcs. Control Panel (default binding at the top heater). 1 pcs. Table for securing solderable boards 1 pcs. Thermocouple with mounting bracket 1 pcs. USB cable 1 pcs. Power cable 1 pcs. Instructions for use 1 pcs. Warranty passport (if not included in the user manual) 1 pcs.
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