Envisiontec Ultra 3sp 3d Printer

US $9500

  • Providence, Rhode Island, United States
  • Oct 31st
ULTRA® ULTRA® 3SP® and 3SP® High Definition EnvisionTEC’s   ULTRA  3SP   Series    3D   printers  use    ground-breaking   3SP   (Scan,    Spin    and Selectively  Photocure)  technology  to   quickly   3D  print   highly   accurate  parts    from   STL  files regardless  of  the   geometric  complexity.    The  ULTRA 3SP  and   3SP  High   Definition   are   each delivered  and   installed  with   all   the   relevant  software  to    enable   automatic   generation   of supports and  perfect model production.  The surface quality   of the  printed models show  no signs of stairstepping on the  inner  and  outer surfaces.  The  reliability  of the  imaging light source and  the high  speed productivity makes it the  most   competitive 3D printer on the  market today. Machine Properties *              ULTRA® 3SP®                                                   ULTRA® 3SP® High Definition Build Envelope                          10.5" x 6.9"  x 7.6" (266 x 175 x 193 mm) 10.5" x 6.9"  x 7.6" (266 x 175 x 193 mm) Resolution in X and  Y                   0.004" (100 µm)                         0.002" (50  µm) Dynamic    Voxel    Resolution in Z (User Adjustable and Material  Dependent)** 0.002" - 0.004" (50  - 100 µm) 0.002" - 0.004" (50  - 100 µm) Materials Available         Ideal for ABS Flex 3SP® (Black,  White) Models similar  to ABS plastic  with  flexibility  characteristics ABS Flex Plus 3SP®                          Models similar  to ABS plastic  with  flexibility   characteristics ABS Tough  3SP®                                  Rigid, stable models similar  to  those made with  ABS plastic ABS TRU 3SP®                                     Models similar  to  those made with  ABS plastic E-Denstone 3SP®                               General purpose, high  temperature  molding, concept  models E-Glass  3SP®                                            Strong, clear  material with  flexible   capabilities E-Tool 3SP®                           Molds for thermoplastic short  run  injection molding System Properties » A single  material is used  for both  build  and  support » Easily removable, partially  cured  perforated supports » Very few  moving  parts  make the  system user-serviceable » Office friendly  plug-and-play operation with  a built-in touch screen » Extremely reliable system utilizing  3SP (Scan,  Spin,  and Selectively Photocure) technology » Low part  cost  due  to minimal material waste » Produce everything from  concept models to functional parts » Layerless  technology with  no  stair  stepping  on  inner  and  outer surfaces » Quiet  operation Footprint (L x W x H): 29" x 30"  x 46"   (74  x 76 x 117 cm) Optional Stand (L x W x H): 29" x 30"   x 25"   (74  x 76 x 64  cm) Weight: 198 lbs (89.8 kg) Electrical  Requirements: 100-127 VAC, 50/60 Hz, single  phase, 8A 200-240 VAC, 50  Hz, single  phase,  4A

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