Esi 5330 Laser Drilling System

US $6100

  • Hillsboro, Oregon, United States
  • Oct 20th
 ESI 5330 Laser Drilling System   The ESI 5330 enables customers the shrink pad design for increased density of circuit boards and electronic packages. ESI’s model 5330 UV laser µvia drill incorporates a high-power diode-pumped laser with pulse repetition frequency of up to 70 kHz and can cut copper with excellent quality and productivity rates of up to 15,000 vias per minute. The system is designed with the capability to have various optical configurations to meet the needs of HDI and IC packaging markets. The optional shaped-beam capability guarantees excellent quality, improves registration, and produces highly circular vias, high throughput, and excellent bottom copper quality with no resin residue. No external water or gas is needed, allowing for easy installation and low operating costs. The Model 5330 is an addition to the 5300 family of UV and CO2 laser drills, a platform that delivers high accuracy to +/- 10 microns. The 5300 family of laser drills have been designed to protect the manufacturer's initial capital investment through cost effective field upgrades. For example, the system architecture allows for the latest model laser, optical bench or galvanometer to be replaced at customer site as newer technology is introduced in the market  This is a working system that has a 6 month limited warranty.    Buyer to pay via Company Check, Bank Check, Credit Card (No PayPal). 50% within 24 hours of Auction end and balance at time of pick-up. Shipping = Buyer responsible for all costs involved to package, crate and ship.  Buyer is also responsible for any and all taxes, customs fees and duties. Buyer to arrange pick-up time with Seller. Buyer can at their option, hire private party or pay seller additional fee to package and crate system to prepare for shipping.   ESI, esi, esi5330, ESI5330, 5330, 5200, 5220, Laser, Laser Drilling, uVIA, pcb drill, YAG

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