Evg 40 Substrate Top To Bottom Measurement System - Hardly Used

US $8,000.00

  • Fremont, California, United States
  • Jan 29th
EVG®40 Substrate / wafer parameters Substrate size up to 200 mm Substrate thickness Max. 10 mm Alignment stage Chuck alignment stage Y: ± 5 mm X: ± 105 mm Measurements Accuracy < 0.5 ?m (3? Repeatability 0.4 ?m (3?) Reproducibility 0.4 ?m (3?) Throughput 40 – 80 measurements / hour Measurement types Top-to-Bottom (T/B) -InfraredTransmitted Microscopes Camera Analog Digital Objectives 5x, 10x, 20x Depth of focus 55 ?m (5x), 15 ?m (10x), 6 ?m (20x) Focus drive Motorized Autofocus N/A
Condition:
Used: An item that has been used previously. The item may have some signs of cosmetic wear, but is fully operational and functions as intended. This item may be a floor model or store return that has been used. See the seller’s listing for full details and description of any imperfections. ...
Brand EVG Group
Model EVG 40

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