Gasonics Aura 1000 Plasma Asher Descum Semiconductor Process Equipment, US $35,000.00 – Picture 0

Gasonics Aura 1000 Plasma Asher Descum Semiconductor Process Equipment, US $35,000.00 – Picture 1

Gasonics Aura 1000 Plasma Asher Descum Semiconductor Process Equipment, US $35,000.00 – Picture 2

Gasonics Aura 1000 Plasma Asher Descum Semiconductor Process Equipment, US $35,000.00 – Picture 3

Gasonics Aura 1000 Plasma Asher Descum Semiconductor Process Equipment, US $35,000.00 – Picture 4

Gasonics Aura 1000 Plasma Asher Descum Semiconductor Process Equipment, US $35,000.00 – Picture 5

Gasonics Aura 1000 Plasma Asher Descum Semiconductor Process Equipment, US $35,000.00 – Picture 6

Gasonics Aura 1000 Plasma Asher Descum Semiconductor Process Equipment, US $35,000.00 – Picture 7

Gasonics Aura 1000 Plasma Asher Descum Semiconductor Process Equipment, US $35,000.00 – Picture 8

Gasonics Aura 1000 Plasma Asher Descum Semiconductor Process Equipment, US $35,000.00 – Picture 9

Gasonics Aura 1000 Plasma Asher Descum Semiconductor Process Equipment, US $35,000.00 – Picture 10

Gasonics Aura 1000 Plasma Asher Descum Semiconductor Process Equipment, US $35,000.00 – Picture 11

Gasonics Aura 1000 Plasma Asher Descum Semiconductor Process Equipment

US $35,000.00

Santa Clara, California, United States
Jan 30th

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Condition: Complete, working, We sell it at AS IS Where IS( Refurbished by seller with installation and warranty is optional) Wafer Size: 6 inch configuration. Process Gasses: O2 and N2 Valid Time: Subject to prior sale without notice. Lead Time: Ready to go (8 weeks for refurbished condition) Location: Silicon Valley, CA, U.S.A. Warranty and Refund: No (Optional for refurbished condition) Gasonics Aura 1000 plasma Asher semiconductor equipment General Description for reference only The Gasonics Aura 1000 Plasma System is a microprocessor controlled down-stream, or “afterglow” photoresist stripper that will strip the front and backside of a wafer, typically in less than one minute.The Gasonics Aura 1000 is fully automated, cassette-to-cassette, and is a single-wafer process design. The Gasonics Aura 1000 system consists of two separate but interconnected.vacuum ·chambers (reaction and stripping), ·a microwave plasma generator, automatic wafer loader/unloader, keypad panel/display, mass flow controllers (MFC’ s ), an infrared heat source, pneumatic and electronic control systems, ‘stainless steel gas plumbing, and incorporates several safety interlock features, as well as troubleshooting indicators . (LED’s) that illuminate to display the operating sequence and key component function signals. The Gasonics Aura 1000 semiconductor process system is housed in one of three basic configurations: 1. A functional, convenient table-top cabinet; 2. Through-the-,wall; or 3. Stand-alone mounting table._ The Gasonics Aura 1000 Auia Stripper System generates a plasma of oxygen and/or other gasses in a reaction chamber. This concentrated reactive mixture then flows downstream, reaching a state of electrical neutrality, . and although highly reactive, it is no longer electrically damaging to the wafer. The mixture then enters the process chamber, where the dissociated oxygen· reacts-with the photoresist and oxidizes or “burns” the photoresist from the wafer. The main components of the Gasonics Aura 1000 Aura plasma reaction is atomic oxygen (normal oxygen consists of two atoms, while atomic oxygen consists of only one atom). In addition, an infrared heat source is included for difficult or temperature sensitive processes. A typical plasma wafer stripping process is as follows: A. The wafer is loaded from a cassette into the process chamber, which is sealed and evacuated, and heat lamps are energized to elevate the wafer temperature. B. Regulated process gasses are precisely released into the reaction chamber. C. The microwave generator is enabled, creating the plasma in the reaction chamber and initiating the downstream stripping action in the process chamber. D. When end-point detection is reached and overstrip is achieved, the microwave generator and process gasses are turned off to stop the stripping action, the process chamber is purged with N2 to ambient temperature, and the stripped wafer is removed from the chamber and placed in another cassette. Gasonics Aura 1000 System Features Single wafer processing One-to-four process gas MFC’s 3?, 4?, 5?, and 6? wafer capability Throughput: 60 wph, depending on process parameters. 3 Configurations: Table-top, Through-the-Wall,or with a stand-alone mounting table. Programmable microprocessor Automatic wafer loader/unloader Infrared heat source for process temperature control. Downstream processing: No wafer radiation damage. Soft-start vacuum system. Quartz or Ceramic plasma chamber. Equipped with hard-wired safety interlocks to prevent damage to the system or injury to either the product or to personnel. Front and backside resist removal Automatic photo emission type end-point detection In-line cassette-to-cassette. Compact: 36? X 32?X27? (Table Top). We have good source for the following used semiconductor equipment and New Semiconductor Equipment / System. Please contact us by e-mail for more information.We will do our best to meet your budget. Rapid Thermal Process: AG Associates Heatpulse 610 | Heatpulse 410 | Heatpulse 210 Plasma Asher Descum:·Matrix 105R | Matrix 105/205/106 | Branson IPC L3200 |Branson IPC 2000/3000/4000 | Gasonics L3510 | Gasonics Aura 1000 | Gasonics Aura 3010 | Gasonics Aura 2000LL Plasma Etch/RIE/ICP: Tegal 901e | Tegal 903e |Tegal 901e TTW | Tegal 903e TTW | Lam Rainbow 4420/4428 | Lam Rainbow 4520/4528 | Lam Rainbow 4620/4628 | Lam Rainbow 4720/4728 | Lam AutoEtch 490 | Lam AutoEtch 590 | Lam AutoEtch 690 | Lam AutoEtch 790 | Matrix 303 | Gasonics AE 2001 | STS Multiplex ICP Sputtering Deposition System: AccuSputter AW 4450 | Perkin Elmer 4450 Sputter | Perkin-Elmer 4410 | Perkin Elmer 2400 Sputter Systems Metrology and Tester: Tencor M-Gage 300 | Hitachi CD-SEM 8840 | Hitachi CD-SEM 8820 | Hitachi FE-SEM 4700 | Hitachi FE-SEM 4500 | HP 4062UX Tester | HP 4145A/B Tester | EG 2001 Wafer Probe | EG 1034 Wafer Probe Please Note: We do not arrange the shipment overseas. For international shipping, please send us your account (FEDEX) or ask your forwarder to pick up the items after you complete the transaction on our eBay store and payment is clear. Note : We are not responsible for any shipping cost, Customs Duties, import Taxes and fees for Orders shipped to countries outside of the United States. These fees can vary widely from country to country. Please contact your local customs office for further information. The buyer is responsible for assuring that the product can be lawfully imported to the destination country.

Condition	New other (see details) : A new, unused item with absolutely no signs of wear. The item may be missing the original packaging, or in the original packaging but not sealed. The item may be a factory second or a new, unused item with defects. See the seller’s listing for full details and description of any imperfections.
Seller Notes	“We did not test the equipment. We sell the system at AS IS condition without warranty and refund.Inspection is available against appointment by sales@quicksemi.com”