Mei Mech-el Marpet Enterprises Inc. 1204b Wire Ball Bonder

US $12000

  • Longwood, Florida, United States
  • Jun 15th
MEI Mech-El Marpet Enterprises Inc. 1204B wire ball bonder Unit as shown - no work holder MECH-EL / MEI 1204B   The MechEl / MEI 1204 is available in two configurations The MEI 1204B (Ball Bonder) and MEI 1204W (Wedge Bonder).  Both the MEI 1204B and W will handle wire sizes from 0.0007” (17um) to 0.003” (75um) and are available with a full line of work holder and options to fit all applications.  SPECIFICATIONS:  Bonding Processes: Thermocompression or thermosonic ball bonding using gold wire. Wire sizes:  1 mil (25 micron) wire standard.  0.7 mil (18 micron), 2 mil (51 micron), and 3 mil (76 micron) capability available. Tip Weight: 15 - 150 grams. Capillary size: 0.063" x 0.375" (1.6mm x 9.5 mm) standard. Heated Workstage: Digital heat control option will regulate temperature from ambient to 300°C +/- 0.5% (dependant upon application). Ultrasonics: Uthe 10G generator with 25ST transducer standard. Micropositioner: 6:1 standard.   Services: Electrical: 110-115 VAC, 50/60Hz, 5 amps or 220-240 VAC, 50/60Hz, 2.5 amps. Air: 40 PSI (240 kPa) minimum, if required. Vacuum: 20" (510 mm) Hg minimum, if required. Dimensions:   Length: 12.0" (30.5 cm) Width: 18.0" (45.7 cm) Height 17.75" (45.1cm) Net Weight: 50 pounds (23 Kg)

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