Mg Chemicals 4900 Sac305, 96.3% Tin, 0.7% Copper, 3% Silver, No Clean Lead Free

US $39

  • USA, United States
  • Jun 8th
Best Selling Stuff ABOUT US Feedback Other items NEWSLETTER MG Chemicals 4900 SAC305, 96.3% Tin, 0.7% Copper, 3% Silver, No Clean Lead Free Solder, 0.032" Diameter, 1/2 lbs Spool PRODUCT DESCRIPTION Lead free, complies with RoHS Exceeds the impurity requirements of J-Std-006 No clean flux, excellent wettability Hard non-conductive residues 1/32" Diameter FEATURES M.G. Chemicals no clean Lead-Free Solder was designed with 96.3 percent tin, 0.7 percent copper and 3 percent silver alloys as a lead-free alternative for the standard Tin and Lead solder. These alloys conform to the impurity requirements of J-Std-006 and RoHS. Use this solder anywhere you would use normal solder. M.G. Chemicals Lead Free Solder utilizes a state-of-the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves constant monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for our Lead Free Solder is 2.0-4.0 percent. A unique flux system was specifically used for high temperature lead free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator that wets and spreads like an RA type. This special activator exhibits virtually no spattering. Activator conforms to J-STD-004, REL0. Cleaning Flux core is a no clean formulation therefore the residues do not need to be removed for typical applications. Ag content: 2.8-3.2 percent . Cu content: 0.3-0.7 percent . Sn content: Balance. Flux classification: ORL0. Copper mirror: no removal of copper film. Silver chromate: pass. Corrosion: pass. SIR JSTD-004,Pattern down: 2.33 x 10 11 ohms. SIR Bellcore (Telecordia): 6.12 x 10 11 ohms. Electromigration: pass. Post reflow flux residue: 55 percent . Acid value: 190-210. Flux residue dryness: pass. Spitting of flux-cored solder: 0.30 percent . Solder spread : 130 mm2. Melting point: 217-221 degree C (422.6 - 429.8 degree F). Upper temperature limit: do not to exceed 350 degree C (tip temperature). Wire diameter: 0.032" (0.81 mm). Standard wire gauge: 21. Tolerance: +/- 0.002". Hardness, brinell: 15HB. Coefficient of thermal expansion: pure Sn=23.5. Tensile strength: 4312 psi. Density: 7.39 g/cc.. MORE INFO Manufacturer: MG Chemicals Shipping Weight: 55 Product Dimensions: Width: 2.20 Length: 2.30 Height: 1.30 Shipping Info -Even though eBay only allows us to enter three different shipping methods, we use a wide variety of shipping methods in order to best serve all of our customers. So don't look at the exact name of the shipping method, but look at the estimated delivery date, and choose based on that :) -All of our stock is located in the United States. -Most orders will ship out within one business day. 30 Days Return & Refund Policy -All items can be returned for a full refund within 30 days from purchase. -Please understand that due to our logistics solution we normally can't send out replacements. We'll send you a full refund though which you can then use to purchase the item again. -In case of buyer remorse the customer is responsible for return shipping. -If the item is damaged, not as described, etc., we will happily provide a prepaid shipping label so you can return the item at no cost to you. -Make sure to keep the packaging of the item until you're sure you don't have to return the item. Only returns with all the original packaging and accessories can be accepted. Satisfaction Guaranteed -We are super proud of our high feedback rate, and work hard every day to keep it that way. If for any reason you're not satisfied with your order, please let us know and we'll do our best to make it right. -If you know of any way we can improve our service, do please let us know :)

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