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NSC PA103 Plastic Mold Decapsulation System Reverse Engineer IC Chips, US $8,499.99 – Picture 0
NSC PA103 Plastic Mold Decapsulation System Reverse Engineer IC Chips, US $8,499.99 – Picture 0

Nsc Pa103 Plastic Mold Decapsulation System Reverse Engineer Ic Chips

US $8,499.99

  • Boise, Idaho, United States
  • Jan 29th
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    NSC PA103 Plastic Mold Decapsulation System. Uses fuming Nitric Acid to remove top layer of IC to see circuitry inside.     Used NSC - PA103, Plastic Mold Decapsulation System. Self contained system performs the definitive decapsulation of plastic mold IC packages. Uses fuming acid as etchant in a heated circulation system. 120V, 60 Hz. This item came from a Fab and powers up, pumps make priming noise and appear to work. Since we are unable to test further we offer this item as is with a 7 day not DOA guarantee. This item will be shipped by Fedex and will be insured for the purchase price to the lower 48 USA. AK, HI, PR to pay actual shipping cost. Returns are allowed within 7 days, buyer to pay return insured shipping. See all the details on these at the following website. http://www.siliconinvestigations.com/NSC/pa103.pdf Please see my eBay store for more Semi Conductor manufacturing items.           Thank you for taking the time to look at my items. If you have any questions, please email me and I will do my best to answer them.   Froo www.froo.com | Froo Cross Sell, Free Cross Sell, Cross promote, eBay Marketing, eBay listing Apps, eBay Apps, eBay Application

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