Open Top Csp / Fbga Burn-in Socket (777f1179h201c)

US $19.95

  • Vancouver, Washington, United States
  • Jun 9th
The 777F1179H201C from WellsCTI is an Open Top burn-in/test socket for CSP / FBGA packages on 0.8 mm pin pitch Features Open top chip scale package and fine pitch BGA's Accommodates pitch sizes of 0.65mm, 0.75mm and 0.80mm Compact size and low actuation force 4-Point pinch contact design for enhanced electrical contact Unique mechanism to eliminate solder ball sticking Field replaceable package location plate, available in most outlines Thru hole design Features Temperature Range 150 °C   Package Type CSP / FBGA  Pitch (mm) 0.8 Number of Positions 115 Package Size (mm)      12 x 18   Socket Style Open Top   Termination Style Through hole  
Condition:
New other (see details): A new, unused item with absolutely no signs of wear. The item may be missing the original packaging, or in the original packaging but not sealed. The item may be a factory second or a new, unused item with defects. See the seller’s listing for full details and description of any imperfections. ...
Brand WellsCTI
MPN 777F1179H201C
Model Open Top burn-in/test socket for CSP/FBGA packages
Country/Region of Manufacture United States

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