Rofin-sinar Sc200f With Uw180c Workstation Laser Cutter Silicon Wafers

US $2600

  • San Jose, California, United States
  • May 28th
ROFIN SC200F WITH UW180C WORK STATION LASER CUTTER  This Equipment is used in Silicon Wafer Manufacturing. Fiber Laser (200 W, Lambda=1070 Laser Parameters: Laser ranges : Ave power =20 W, Frequency = 375 Hz, Pulse duration = 0.23ms, Lambda =1064nm, 6x beam expander, 1.8/1.9mm amperatures front/rear, Kerf = 80um Assist Gas : Nitrogen  The system has been on a maintenance contract with ROFIN since new, and it is in full operational condition at this time. This system is available for inspection at our San Jose, CA area facility.  We can also arrange for inspection under power, as well demo wafers. Please contact us for full details - including extensive photo sets.  The photo attached, is the laser cutter as it sits today. Thank You 

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