South Bay Technology 575 Beaps Backside Thinning Decapsulation Ultra Tec Asap-1

US $3,410.00

Santa Fe, New Mexico, United States
Jan 30th

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South Bay Technology 575 BEAPS Backside Emission Analysis Preparation System This is a South Bay Technology model 575 BEAPS Backside Emission Analysis Preparation System with motorized Y-axis, specimen mounting plate, 2 inch x 10 mm coarse diamond tool, and user manual. Advances in semiconductor technology have led to the introduction of multiple metal layers and complete metal ground planes interconnected with vias. In today's advanced semiconductor designs, many layers of metallization can trap weak photon emissions beneath overlying metallization or force emissions at such low incident angles respective to the optics that even extended numerical aperture lenses are unable to detect them. The BEAPS system utilizes a versatile stage which can either rotate or oscillate along the Y-axis and allows for a wide range of package and die sizes to be accommodated. Adjustments set by the user allow only selected areas of the package to be thinned, which helps prevent lead damage and other adverse effects traditionally encountered with standard back thinning methods. A variety of tools allows for the production of highly polished surfaces which are important for the transmission of the weak photon emissions generally associated with backside failure analysis. Various sized grinding and polishing tools are available to both create the desired thin area and to produce the desired surface finish. The BEAPS Solution The SBT BEAPS is a total solution to Backside Emission Analysis Preparation. The Backside Polishing Station is a precision polishing station which provides a means to flat polish a large, predefined area to within 10μ of the metallization layer with minimal supervision. All leads are also left intact which simplifies device biasing and allows for the use of commercially available sockets. Design Depth micrometer, with 1μ resolution controls the amount of material to be removed. Arm mechanism which houses the drive pulleys and the arbor shaft where grinding and polishing tools up to 2" diameter are mounted Motorized stage can oscillate up to 25 mm along Y-axis Rotating pedestal can be rotated 360° continuously Special Features Produces large polished areas on packages as large as 4 inches Automatic depth control allows precision polishing to within 10μ of metallization layer Leads are left intact for easy device biasing Ideal for both plastic and ceramic package Click Here to Download More Info Specifications Retail Price $12,818.65 Inspection by a Hofstra Group technician allows us to guarantee this hardware to perform to your satisfaction. This item carries a 7-day unconditional right of return and a 90-day warranty. In the unlikely event that you need to return it, we will arrange and pay for return shipping in addition to refunding the purchase price and original shipping. Please review our Sales Agreement for more information. _gsrx_vers_568 (GS 6.7.3 (568))