Sputtering Target Cu/ga 7:3 At% 2.00" Dia X 0.125" Thick, Bonded To Cu Backer

US $8300

  • San Jose, California, United States
  • May 28th
Here we have a copper gallium sputtering target, 7:3 atomic percent, 99.99% pure. It is bonded to a copper backing plate for support. This is a very brittle phase, and cracked during final machining. Because of its flawed appearance, it is deeply discounted in price. The size is 2.00" diameter x 0.125" thick, total thickness 0.25".

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