Tpt Hb14 Ball Bonder & Wedge Bonder

US $9,000.00

  • Jensen Beach, Florida, United States
  • Jan 29th
TPT HB14 Ball Bonder & Wedge Bonder Options: H26 - Heated Stage H30 - Wedge Bonding H35 - Loop Profile H50 - Laser Pointer Targeting H72 - 1/2" Wire Spool Adapter   The HB14 is a bench top size wire bonder, easy to operate and ideal for laboratories,pilot and pre-production runs and small scale production lines.One Bond head for wire bonding in Ball/Wedge or Wedge/Wedge bonding mode.No hardware change necessary. Easy operation with TFT Touch Panel Operator System. This TPT model HB14 can both ball bond (PIC 4) and wedge bond (PIC 5). Digital temperature controller shown at 100 degrees C next to floppy (PIC 1&2). Can use either 1/2" spool of gold bonder wire or 2" motor feed spool. Microscope is Leica S6 with 16X eye pieces. Unit has a laser pointer that puts a small red dot on bond target. Built-in fiber optic lights. Tested and performs bonds well. Any questions? Call or text my cell: 772-263-1100 Powered by eBay Turbo Lister The free listing tool. List your items fast and easy and manage your active items.
Condition Used :
An item that has been used previously. The item may have some signs of cosmetic wear, but is fully operational and functions as intended. This item may be a floor model or store return that has been used. See the seller’s listing for full details and description of any imperfections.
Seller Notes Excellent condition, like new.

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