Ultron UH108 for Backgrinding Tape App. with Options, US $15000 – Picture 0

Ultron UH108 for Backgrinding Tape App. with Options, US $15000 – Picture 1

Ultron UH108 for Backgrinding Tape App. with Options, US $15000 – Picture 2

Ultron UH108 for Backgrinding Tape App. with Options, US $15000 – Picture 3

Ultron UH108 for Backgrinding Tape App. with Options, US $15000 – Picture 4

Ultron UH108 for Backgrinding Tape App. with Options, US $15000 – Picture 5

Ultron UH108 for Backgrinding Tape App. with Options, US $15000 – Picture 6

Ultron UH108 for Backgrinding Tape App. with Options, US $15000 – Picture 7

Ultron Uh108 For Backgrinding Tape App. With Options

US $15000

Palisades Park, New Jersey, United States
Jun 4th

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Feel free to contact us for additional information through ebay mail, or directly at: nrscientific@gmail.com or at (201) 592-1864. Ultron Systems Wafer Backgrinding Tape Applicator Model UH108 S/N: 940422 Electrical Specifications: 115v/ 1A./ 1-Ph./ 50-60Hz Options installed: 1. Static Elliminator 2. Take up Roller Assembly. Current cost is $8,850. ($6,450 base price, $1,150 for Static Elliminator option, $1,250 for Take Up Roller Assy.) This system is in excellent condition and is provided with a no-nonsense 4 month parts/labor warranty. For your reference, the seller is N&R Scientific Co., Inc. We have been providing the highest quality refurbished and fully guaranteed equipment worldwide for many years. You can purchase with complete confidence that the equipment will be provided in excellent cosmetic and perfect operational condition. Our facility is located in the metropolitan NYC area. Manufacturer's Description: Uniform Film Application: The Model UH108 has an easily adjustable built-in spring-loaded roller assembly, which assures even, bubble-free lamination of the film to the wafer. Control: The film cutting system offers adjustable cutting angle, depth and diameter to control the amount of film overhang. Roller pressure is adjustable from the topside of the unit for different film requirements and to accommodate various wafer thicknesses. The Wafer Centration System assures alignment and cutting consistency from wafer to wafer. Versatility: Adjustable alignment pins accommodate any wafer size. The cutter assembly is adjustable for either a contact cut - for wafers with alignment flat(s) or non-contact cut - for wafers with an alignment notch. In addition, the Model UH108 uses a spring-loaded tensioner bar to prevent wafer stress due to film stretch. Take-up Roller Assembly Option: A gear-driven take-up Roller Assembly is available for use with protective layer-backed films. This assembly automatically winds the protective layer onto a plastic core for easy handling and disposal. Static Eliminator Option: A static ionization bar is available to prevent static buildup caused from the film unwinding or from the separation of the film from the protective layer. Edge-Contact Stage Option: For applications that require that the face of the wafer not contact the surface of the workstage, this stage will suspend the wafer by holding it in place via a narrow vacuum groove around its outside edge. An adjustable air pressure support fills the cavity to prevent the wafer from bowing during film lamination.