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ESEC 8003 DICING SAW, US $12,900.00 – Picture 0
ESEC 8003 DICING SAW, US $12,900.00 – Picture 1
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ESEC 8003 DICING SAW, US $12,900.00 – Picture 3
ESEC 8003 DICING SAW, US $12,900.00 – Picture 4
ESEC 8003 DICING SAW, US $12,900.00 – Picture 5
ESEC 8003 DICING SAW, US $12,900.00 – Picture 0
ESEC 8003 DICING SAW, US $12,900.00 – Picture 1
ESEC 8003 DICING SAW, US $12,900.00 – Picture 2
ESEC 8003 DICING SAW, US $12,900.00 – Picture 3
ESEC 8003 DICING SAW, US $12,900.00 – Picture 4
ESEC 8003 DICING SAW, US $12,900.00 – Picture 5

Esec 8003 Dicing Saw

US $12,900.00

  • North Billerica, Massachusetts, United States
  • Jan 30th
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 ESEC 8003 The Esec 8003 Dicing Saw (wafersaw) is a precision machine used to cut semiconductor wafers into individual chips or dice. ESEC 8003 DICING SAW                                                                           6.5" X 9" (X TRAVEL) CAPABLITY HIGH POWER SPINDLE MOTORIZED THETA MOVEMENT Our equipment is sold in good working condition, guaranteed to work and fully operational. We have one of the largest inventories of semiconductor manufacturing equipment for sale in the world, serving the needs of Colleges and Universities worldwide  (Have been in business since 1982) All shipping costs to return the product are the responsibility of the buyer. International Buyers must arrange shipping   we'll provide weights and dimensions Packaging for international and crated shipments will be added to invoice. Please Visit our E-Bay Store and check our other auctions
Condition:
Seller refurbished: An item that has been restored to working order by the eBay seller or a third party not approved by the manufacturer. This means the item has been inspected, cleaned, and repaired to full working order and is in excellent condition. This item may or may not be in original packaging. See the seller’s listing for full details. ...
Brand ESEC
Model 8003

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