- Cleveland, Ohio, United States
- Jan 30th
Minimet 1000 can be used for precision thinning and mirror polishing required for different applications, e.g., polishing of small wafers. To remove material, the specimen is placed on a variably loaded arm that moves in a circular geometric pattern bounded by a stationary polishing bowl. Material removal is done by a grinding disc, or by a combination of abrasive/lapping/polishing cloth and glass backing disk, placed on the bottom of the bowl.