Kla Tencor 2132 Bright-field Wafer Inspection !price Reduced!

US $15,600.00

  • Boerne, Texas, United States
  • Jan 30th
1680 Up for sale is our KLA Tencor 2132 Wafer inspection tool. This tool is in excellent condition, please see photos and details below for configuration. This tool will be sold as-is, where-is. Currently stored in our Germany warehouse. No Reasonable offers refused Thanks for looking and happy bidding! Manufacturer: KLA TENCOR Model: 2132 Type: bright-field WAFER INSPECTION Version: 200 mm Condition: excellent Vintage: Aug 1995 Sale condition: as is where is Quantity: 1 Comments: Serial number W21XX639 Deinstalled by KLA, Warehoused, barrier bagged. The system was deinstalled in september 2002 and until that date was upgraded with various hardware and software upgrades. Stored at the warehouse of SDI, GERMANY Facilities: 120v 3 phase 25A KLA2132 Board Configuration *************************** MAIN CARD CAGE DP 710-683424-001 REV AA DF 710-661726-00 BD1 API 710-658036-00 REV C1  API 710-658041-20 REV E0  UP 710-658046-00 REV F0  XINT 710-658176-00 REV A0  YINT 710-658172-00 REV H0  XINT 710-658176-00 REV A0  YINT 710-658172-00 REV H0  CT 710-655651-20 REV C0  CT 710-655651-20 REV C0  MM 710-659412-00 REV C0  MM 710-659412-00 REV C0  MC 710-658232-20 REV H0  IF1 710-658086-20 REV E0  AUXILIARY CARD CAGE ******************* DF 710-678525-001 REV AB  DD 710-650044-20 REV DB0  DP 710-678545-00 REV B1  RTF 710-652840-20 REV D3 710-659485-20 REV?? General Description  ---------------------------- The KLA 2132 is capable of inspecting at the following rates: Sensitivity: 0.62 ------- Speed: 5 sec/cm2 Sensitivity: 0.39 ------- Speed: 15 sec/cm2 Sensitivity: 0.25 ------- Speed: 30 sec/cm2 and includes the following:- wafer inspection module for 4, 5, 6 or 8 inch wafer size image Computer Minimum inspectable feature size of 0.25 um in die to die mode Defect Clustering and Auto Review Sampling Blanket Wafer Inspection Automated Inspection Automatic Focusing SECS-GEM KLA SAT segmented auto threshold imaging processing hardware and software using mean and range functions on the KLA 2132 and KLA 2135 platforms that allows. improved inspection performance on noisy surfaces like CMP and metal reduced inspection setup time enhanced threshold algorithm for all process levels KLA ADC Automated Defect classification Package Includes image processing and analysis software for inspection station .The system has internally two computers: one is the system computer, which controls the machine in run mode; and the other is the ADC computer, which controls the machine in automatic review mode (you can also do manual review mode). The ADC Manager is not included. Fully automatic, non-contact wafer alignment Uses image recognition without special test site requirement Accomodates SEMI standard 25 wafer cassettes Uses pick-and-place, random access wafer handling system Image hard copy Remote image access XV Tencor 6000 loader SUBSTRATES: For silicon wafers conforming to SEMI standard M1.1 Wafer diameter (mm): 100 100 125 150 200 Wafer thickness (?m): 525 625 625 675 725 SENSITIVITY AND INSPECTION SPEED: Die to Die Mode Cell to Cell Mode Sensitivity (?m) Speed (sec/cm?) Sensitivity (?m) Speed (sec/cm?) 0.60 05 0.50 1.5 0.40 15 0.30 05 0.25 30 0.20 15 Full performance specifications are available on request

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