MicroAssembly MAT 6400 Automatic Thermal Die Attach System/Bonder, US $74,999.99 – Picture 0

MicroAssembly MAT 6400 Automatic Thermal Die Attach System/Bonder, US $74,999.99 – Picture 1

MicroAssembly MAT 6400 Automatic Thermal Die Attach System/Bonder, US $74,999.99 – Picture 2

MicroAssembly MAT 6400 Automatic Thermal Die Attach System/Bonder, US $74,999.99 – Picture 3

MicroAssembly MAT 6400 Automatic Thermal Die Attach System/Bonder, US $74,999.99 – Picture 4

MicroAssembly MAT 6400 Automatic Thermal Die Attach System/Bonder, US $74,999.99 – Picture 5

MicroAssembly MAT 6400 Automatic Thermal Die Attach System/Bonder, US $74,999.99 – Picture 6

MicroAssembly MAT 6400 Automatic Thermal Die Attach System/Bonder, US $74,999.99 – Picture 7

MicroAssembly MAT 6400 Automatic Thermal Die Attach System/Bonder, US $74,999.99 – Picture 8

MicroAssembly MAT 6400 Automatic Thermal Die Attach System/Bonder, US $74,999.99 – Picture 9

MicroAssembly MAT 6400 Automatic Thermal Die Attach System/Bonder, US $74,999.99 – Picture 10

Microassembly Mat 6400 Automatic Thermal Die Attach System/bonder

US $74,999.99

Phoenix, Arizona, United States
Jan 30th

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MicroAssembly Technologies 6400 Automatic Thermal Die Attach System/Bonder Comes with a what you see in the pictures. If you don't see it, you probably wont get it. Specifications are from MicroAssembly Technology and may vary slightly due to upgrades, options, or revisions this unit may or may not have. This unit was Intel Surplus. It was removed from service in working condition. They had advertised it as a Thermal Die Attach System / Flip Chip Bonder. We do not have the expertise or the facilities to formally test this unit and are selling it as-is. There appears to be some miscellaneous parts for the unit including different sized chucks in the blue-bin in the picture of the back of the unit. Base List Price is: $150,000.00 to $220,000.00 NEW from MAT The Unit's Serial Number Tag Reads: Model Number: 6400 Serial Number: 802 Power Requirements: 220 V, 50/60 Hz, 16 A, 3520 VA Weight: 160 kg. Date of Manufacture: 12/03 Key Features: Flexible, fully automatic die attach system controlled by user friendly Windows XP based software. Model 6400 performs cold and hot processes for MCM, Flip Chip, Eutectic, and Ultrasonic assemblies. Very high placement accuracy of 3 microns @ 3 sigma (process dependent) is ensured by the closed loop servo systems and the high resolution digital vision system Handles active and passive components with sizes between 200 microns up to over 25 mm. Pick from up to thirty 2" or nine 4" Waffle or Gel packs. Pick from Wafers up to 300 mm Pick from up to 8 Tape & Reel feeders. Specializing in unusual die sizes and aspect ratios. The volumetric dispenser applies adhesive in programmable shapes. Stamping (Pin Transfer) applies adhesive dots as small as 75 microns. Full Flip Chip capability including chip flipping, bump fluxing and chip final alignment over up looking camera. Handles CCD and other sensors, LCD's, MEMS and other sensitive devices Unique die staking capability. Specification Highlights: Work Area: Up to 12" x 10". Die Size: 0.200 to over 50 mm. Die Thickness: from 50 microns. Die Aspect Ratio: over 1:20. Die Material: GaAs, Silicon, Glass, other. Die Presentation: Up to 30 Waffle/Gel packs Up to 8 Tape & Reel feeders One 300 mm Wafer. Volumetric or Time-Pressure Dispensing Stamping (pin transfer) for dots as small as 75 µm. Cold or Hot process up to 500°C with Inert Gas cover (Not sure if this feature is installed but I think it is). Heated pickup tool up to 500°C available (Not sure if this feature is installed but I think it is). Ultrasonic bonding process available (Not sure if this feature is installed but I don't believe it is). Accurate Bond Line Thickness control. Advanced Die Stacking capability. Pickup/Bond Force: 40 – 3000 grams. Placement Accuracy: 3 µm @ 3 sigma depending on application. Throughput: Up to 1000 CPH depending on application. For More Pictures Please Click the Following: Picture 2 - Back View Picture 3 - Die Attach System #1 Picture 4 - Die Attach System #2 Picture 5 - Die Attach System #3 Picture 6 - Die Attach System #4 Picture 7 - Die Attach System #5 Picture 8 - Ribbon Cable Connections on the Back Picture 9 - Front of the Computer Picture 10 - Back of the Computer Picture 11 - Front of the Heater Control Unit Picture 12 - Back of the Heater Control Unit Picture 13 - Serial Number Tag $150.00 minimum for packaging, handling, and order processing. Shipping to be determined by destination. If you have any questions please call Michael at 1-866-MHZ-ELEC (1-866-649-3532) Toll Free. Also, please click here to view or other auctions! 01/31/09 Powered by eBay Turbo Lister The free listing tool. List your items fast and easy and manage your active items.

Condition

Used :

An item that has been used previously. The item may have some signs of cosmetic wear, but is fully operational and functions as intended. This item may be a floor model or store return that has been used. See the seller’s listing for full details and description of any imperfections.

Seller Notes

“This unit was Intel Surplus. It was removed from service in working condition. They had advertised it as a Thermal Die Attach System / Flip Chip Bonder. We do not have the expertise or the facilities to formally test this unit and are selling it as-is. There appears to be some miscellaneous parts for the unit including different sized chucks in the blue-bin in the picture of the back of the unit.”