SpeedFam-IPEC/Novellus 676 AvantGaard CMP System Polisher/Planer/Planarization, US $32,499.99 – Picture 0

SpeedFam-IPEC/Novellus 676 AvantGaard CMP System Polisher/Planer/Planarization, US $32,499.99 – Picture 1

SpeedFam-IPEC/Novellus 676 AvantGaard CMP System Polisher/Planer/Planarization, US $32,499.99 – Picture 2

SpeedFam-IPEC/Novellus 676 AvantGaard CMP System Polisher/Planer/Planarization, US $32,499.99 – Picture 3

SpeedFam-IPEC/Novellus 676 AvantGaard CMP System Polisher/Planer/Planarization, US $32,499.99 – Picture 4

SpeedFam-IPEC/Novellus 676 AvantGaard CMP System Polisher/Planer/Planarization, US $32,499.99 – Picture 5

SpeedFam-IPEC/Novellus 676 AvantGaard CMP System Polisher/Planer/Planarization, US $32,499.99 – Picture 6

SpeedFam-IPEC/Novellus 676 AvantGaard CMP System Polisher/Planer/Planarization, US $32,499.99 – Picture 7

SpeedFam-IPEC/Novellus 676 AvantGaard CMP System Polisher/Planer/Planarization, US $32,499.99 – Picture 8

SpeedFam-IPEC/Novellus 676 AvantGaard CMP System Polisher/Planer/Planarization, US $32,499.99 – Picture 9

SpeedFam-IPEC/Novellus 676 AvantGaard CMP System Polisher/Planer/Planarization, US $32,499.99 – Picture 10

Speedfam-ipec/novellus 676 Avantgaard Cmp System Polisher/planer/planarization

US $32,499.99

Phoenix, Arizona, United States
Jan 30th

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Click Here. Double your traffic. Get Vendio Gallery - Now FREE! Novellus/Westech/SpeedFam/IPEC AvantGaard 676 Chemical Mechanical Planarization System Polisher Comes with a manual, some interconnecting cables, and what you see in the pictures. If you don't see it, you probably wont get it. Specifications are from Novellus and may vary slightly due to upgrades, options, or revisions this unit may or may not have. The system was removed from service in working condition and professional decontaminated however we are unable to test it. It is not in clean room packaging. It is sold as-is. The Polisher's Serial Number Tag Reads: Model Number: MP400 Serial Number: 3053 The Chase Panel's Serial Number Tag Reads: Model Number: 676 Serial Number: 3053 Power Requirements: 120/208 VAC WYE, 3 Phase, 60 Hz, 60 Amps Max. Items Included: Main Polishing Unit Chase Control Panel Genmark Gencobot 3L / 4 Robot with End-Effector Wafer Address Sensors, Model M-825 (25 Wafer) The Unit Was Being Used with the Following Chemicals: Hydrogen Peroxide (7.4% to 50% concentration) Semi-Sperse W2000 (DI Water and Proprietary Metal Oxide) Highlights: The AvantGaard 676 is capable of throughput of 40 or more wafers per hour and offers one of the industry's smallest footprints. These systems can be used to polish either oxide or metal layers, allowing customers to reduce the number of different CMP systems in a wafer fabrication facility. IPEC's newest systems also are designed to improve yields by use of an orbital polishing motion rather than conventional rotational CMP techniques. IPEC's design strategy emphasizes higher levels of reliability and ease of use. Description: The SpeedFam-IPEC AvantGaard 676 Chemical Mechanical Planarization System is used during the semiconductor manufacturing process to planarize individual layers in complex integrated circuits to customer specific parameters. The system (Tool) has four wafer planarizers, an endpoint detection system, dual pad conditioning systems, a fully automated cassette to cassette (C2C) system to move the wafers, and a separate Electrical Cabinet. Cassette to Cassette (C2C): The C2C system uses a multi-axis robot with a wafer pickup safety paddle. A computer controller robot loads, unloads, and transports wafers from location to location in the Tool. The C2C system includes a spray box assembly used to remove slurry particulate, an automated wafer handling robot, and a wet cassette assembly with a dual cassette basin capable of holding two 25 wafer cassettes. The C2C wafer sensing mechanism automatically senses the number of wafers loaded into the cassettes and communicates the count to the system control (SysCon) computer. SysCon Computer: Each of the Tool systems are controlled by independent processing units linked through a master System Control (SysCon) computer for overall system control. Logic control systems and the low voltage and high voltage electrical panel assemblies are located in a separate Electrical Cabinet. The Electrical Cabinet is typically located on the chase (back) side of the tool. Operation: The Tool is operated using the Control Station on the front (operator) side of the Tool. The operator uses a light pen and the monitor to interact with system software and control system functions. Introduction: The AvantGaard 676 Tool plays a very important role in the process of moving wafers through various integrated circuit production steps. With each process stage, the wafer becomes more and more valuable. It also becomes increasingly critical for process Tools to do their work with precision. The Tool polishes specific layers of metal off the top of the wafer and maintains as "planar" a surface as possible. Processing: During wafer fabrication, metal layers are deposited on the wafer to fill patterned through holes and trenches outlined by oxide layers. When filled with metal, these holes and trenches become bridging contacts that connect various components throughout a multiple layered device. Oxide layers, known as ILD (InterLayer Dielectric), insulate between each metal layer and, when etched, contain the connective patterns which are filled by the next metal layer. After the ILD is overlaid with metal, the wafer must be polished to remove excess metal (down to the ILD surface) so the metal remains only in the etches patterns. This polished process, Chemical Mechanical Planarization (CMP), is used to make the wafer surface as flat, or planar, as possible. CMP: CMP occurs through a combination of mechanical and chemical action. Mechanically, the wafer is positioned between two heads that apply specific pressures and a polishing motion calculated to maximize planarization. Chemically, the action of the slurry affects the surface layer. The abrasive slurry on the surface of the pad in combination with pressure and velocity remove the softened surface layer and the slurry fluid carriers the removed material away. This exposes a fresh surface layer and the process starts over. Head Assemblies: When the head assembly has closed onto a wafer, the upper head will begin to rotate. Internal bearings allow the head to spin in the assembly. The wafer head rotates at a speed that is variable from recipe to recipe but seldom exceeds 10 RPM. The lower head also beings to move in the opposite direction in a wave generating path. Speeds are adjusted in the polish recipe to achieve optimal results for various types of polish procedures and materials. The speed of the polish head is faster, but is directly proportional to the rotational speed of the wafer head. Polish Dynamics: Two 208V 3-phase motors are used in each MP assembly, one for the wafer head, and one for the polish head. These motors move the heads and are controlled through the high voltage MP panel assemblies in the Electrical Cabinet. Although independent motors drive the two assemblies, they are connected to the same inverter. Fluids are supplied to the polish process through the polish pad. The pad has 61 small holes that introduce measured quantities of slurry and Di water to the process. The combination of polish pad motion, pressure, and the chemical properties of the slurry being used cause the wafer to be polished. Polish recipes (chosen by the operator) control polish parameters, including polish time, slurry mixtures, polish and wafer pressures, and motor speed. The end of the wafer polishing procedure is determined either by recipe, or by an optional Endpoint Detection System computer monitoring the polishing process. Changes in the polishing process signal an endpoint and the computer stops the process. Testing Polishing Outcomes: After the polishing process is done, operators can do several testing procedures on the wafers to make sure that process specifications have been met. Testing can give an indication of Removal rate, Uniformity, and Particle contamination. Removal: Average removal rate is the average rate of tungsten removal during polishing. It is measured in angstroms per minute using either a ResMap or OmniMap metal thickness measuring Tool. Uniformity: Uniformity is a measure of how consistent the removal rate is across the wafer. Uniformity (or more accurately, non-uniformity) is calculated by multiplying the sample standard deviation by 3, and dividing by the average removal rate. Both removal rate and uniformity are calculated. The Tool uses a 4 point probe to obtain sample data from the wafer. Particle: Particle contamination can be detected using a "Surfscan" Tool, which scans the surface of a wafer to detect evidence of contamination. Because contaminant particles are extremely small, the SurfScan Tool uses a laser to reflect light off the surface of the wafer, then analyzes the light diffraction patterns to identify and locate existing particles. Process engineers post limits on the number of particles that are acceptable per wafer. This figure is known as the upper control limit, or UCL. SurfScan measurements can be done periodically to make sure the contamination level of wafers moving through the Tool. For More Pictures Please Click the Following: Picture 2 - Back View Picture 3 - Right View Picture 4 - Left View Picture 5 - Light Pen and CRT Monitor Controller Picture 6 - Robot Arm with End-Effector Picture 7 - Wafer Address Sensor Picture 8 - Left Wafer Cassette Holder Picture 9 - Right Wafer Cassette Holder Picture 10 - Top Panel Removed (Shows Motors & Robots) Picture 11 - Right Side, Top Panel Picture 12 - Right Side, Bottom Panel Removed #1 Picture 13 - Right Side, Bottom Panel Removed #2 Picture 14 - Right Side, Bottom Panel Removed #3 Picture 15 - Right Side, Door's Open (Polishing Stations) Picture 16 - Left Side, Top Panel Picture 17 - Left Side, Bottom Panel Removed #1 Picture 18 - Left Side, Bottom Panel Removed #2 Picture 19 - Left Side, Bottom Panel Removed #3 Picture 20 - Left Side, Door's Open (Polishing Stations) Picture 21 - Back Side, Middle Panel Removed Picture 22 - Chase Control Panel Picture 23 - The Polishing Station's Serial Number Tag Picture 24 - The Chase Control Panel's Serial Number Tag $500.00 minimum for packaging, handling, and order processing. Shipping to be determined by destination. Prior to shipment I need to know the following information: (1) Are you the end-user of this item? (2) If you are not the ultimate end-user of the item, please state the ultimate end user's name. (3) What is the ultimate country destination? If you have any questions please call Michael at 1-866-MHZ-ELEC (1-866-649-3532) Toll Free. Also, please click here to view or other auctions! 04/02/08 Powered by eBay Turbo Lister The free listing tool. List your items fast and easy and manage your active items.

Condition	Used : An item that has been used previously. The item may have some signs of cosmetic wear, but is fully operational and functions as intended. This item may be a floor model or store return that has been used. See the seller’s listing for full details and description of any imperfections.
Seller Notes	“The system was removed from service in working condition and professional decontaminated however we are unable to test it. It is not in clean room packaging. It is sold as-is.”