Ultrasonic peg bonder - hybond 616-08
Unit celerity brooks mfc mass flow controller 8565c, 200sccm, 4% ch4/ar, multi 2
** thermionics tsp power supply - sublimator ps 500 - for surface analysis
Nikon stgx8-ad2 / 4s025-407 card plug in module
Nikon 4s016-517 card plug in module w/ 4s013-768 (d6)
Nikon stgx8-sl / 4s025-378 card plug in module (e5)
Kla tencor ft-700 prometrix wafer film thickness measurement system
Custom adjustable pneumatic apparatus
Ion systems mks 5200-im6t interface module 5200-im6t-v3.0 (no power adapter)
Nais anup5252 anup5252-722 uv curing system
Fanuc a16b-2200-0840 08f, main cpu pcb module
Brooks automation tlg-rs232 transponder reader tlg-s2-1o00-s0-00eb
Brooks automation 148301 rev a main iv bd.
Manual ball bonder - hybond 512-10-41
Hybond modified bonder, x, y linear stage,joystick 1 616-12
Kulicke & soffa 4590-72-1 rev.c 01418-4080-000-05 board
Rucker & kolls 681a wafer prober with cords as is powers up and stage moves
Custom lever component for wafer bonder assembly
Texas instruments tms320c6211 dsp starter kit new & complete in the box as shown
Micromanipulator probe sample, 7c, 7f, 7f-c10, 7s prober
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